IEC TS 62647-4-2018 pdf free.Process management for avionics -Aerospace and defence electronic systems containing lead-free solder – Part 4: Ball grid array (BGA) re-balling.
The intent of this document is to provide re-balling companies (hereinafter referred to as there-balling provider) with the administrative and technical requirements to be incorporatedwithin existing processes or for establishing，implementing and maintaining a new set ofprocesses or the creation of a stand-alone re-balling process.
This document is intended to be used by de-balling/re-balling providers and customers,typically avionics original equipment manufacturers (OEM); it defines the requirements for re-balling providers who are providing services to the aerospace, defence, high performance andhigh reliability electronics industry.
Requirements for new BGA component part number qualification are also included. Thisdocument identifies the need for the creation of new part numbers for re-balled BGAcomponents，covers process and testing requirements for the de-balling/re-balling processand encourages the automated processes due to the ability to control the process.
Companies engaged in re-balling are supposed to have the necessary knowledge, experienceand tools,and to customize if needed their own methods for defining a de-balling/re-ballingprocess that meets the requirements in this document.
Each customer determines the applicability of this document and the need for full replacementof the existing solder balls.Some applications can have unique requirements that exceed thescope of this document and are therefore specified separately.
This document is not intended to address all procedures and processes associated with a de-balling/re-balling facility; it is assumed there are management, quality,manufacturing, safety,calibration and training processes/procedures in place as well as all the necessary tools andequipment to accomplish the work.
Although developed for the avionics industry, this process can be applied by other industrialsectors at their discretion.
Normative references
The following documents are referred to in the text in such a way that some or all of theircontent constitutes requirements of this document. For dated references,only the editioncited applies. For undated references, the latest edition of the referenced document (includingany amendments) applies.
IEC 61340-5-1，Electrostatics – Part 5-1: Protection of electronic devices from electrostaticphenomena – General requirements
IEC TR 61340-5-2, Electrostatics – Part5-2: Protection of electronic devices fromelectrostatic phenomena – User guide
IEC 62090，Product package labels for electronic components using bar code and two-dimensional symbologies
IEC 62668 (all parts)，Process management for avionics – Counterfeit preventionAEC-Q100-010，Solder ball shear test
ANSIESD s20.20，Protection of Electrical and Electronic Parts，Assemblies and Equipment(Excluding Electrically Initiated Explosive Devices)
ECA/IPC/JEDEC J-STD-075，Classification of Non-IC Electronic Components for AssemblyProcesses
IPC J-STD-001，Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001xS1，Space Applications Electronic Hardware Addendum to lPC J-STD-001×Requirements for Soldered Eiectrical and Electronic Assemblies
IPC J-STD-002,Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires.IEC TS 62647-4 pdf download.