BS EN ISO 9453:2014 pdf free.Soft solder alloys — Chemical compositions and forms (ISO 9453:2014).
BS EN ISO 9453 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 3677, Filler metal for soft soldering, brazing and braze welding — Desqnation
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1 soft solder
metallic filler material which is used to join metallic parts and which has a melting temperature (liquidus) lower than that of the parts to be joined and, usually, lower than 450 °C and which wets the parent metals
3.2 batch
collection of one or more units of product, made in a single production operation
4 Chemical composition
The chemical composition of the soft solder, sampled and analysed in accordance with Clause 6. shall be as given for the appropriate material in Tahici. or Table2.
5 Forms of delivery
5.1 General
Soft solders conforming to this International Standard shall be supplied in one of the following forms:
ingot, slab, stick, bar, rod, wire, pellets, preforms, rings, spheres, ribbons, powder or soldering pastes. Solder shall be uniform in quality and free from detrimental conditions such as contamination or surface oxide that prevent melting and flow in a manner suitable for the intended application.
5.2 Unit of product
The unit of product used for defining the requirements for the marking of soft solders varies with the form of the solder.
6 Sampling and analysis
Pending the publication of International Standards for sampling and for methods of analysis for soft solder alloys, the methods used shall, in cases of dispute, be agreed between the supplier and the purchaser.
NOTE Preferred analysis methods are Spark-OES and AAS.
7 Marking, labelling and packaging
Each batch of solder supplied in accordance with this International Standard shall be marked with the
information indicated by a cross in Table 4.
The information in Table 4 shall be applied to the product forms as follows:
a) for ingots and slabs: by stamping, or inkjet marking on the surface of each unit of product;
b) for sticks, bars, rods and wire in coil: either on a label securely attached to each unit of product, or on a label on the package in which the units of product are contained;
c) for wire or ribbon on reels: on a label on each reel;
d) for pellets, preforms, spheres, powder, soldering paste: on a label on each individually packaged quantity.
All product forms shall also be labelled with any health and safety warnings required by the relevant rules and regulations of the country of manufacture, or as specified in the order.BS EN ISO 9453 pdf free download.