IEC 60749-12-2017 pdf free.Semiconductor devices – Mechanical and climatic test methods—Part 12: Vibration, variable frequency.
4 Test apparatus
The apparatus for this test shall include equipment capable of providing the required variable frequency vibration at the specified level and the necessary optical and electrical equipment for post-test measurements.
5 Test method
The device shall be rigidly fastened on the vibration platform and the leads or cables adequately secured to avoid excessive lead resonance. The device shall be vibrated with simple harmonic motion having either a peak to peak amplitude of 1,5mm (±10%) or a peak acceleration of the specified test condition A. B. or C in Table 1. below.
Unless required by the relevant specification, the test conditions detailed in Table 1 below shall be applied. Test conditions shall be amplitude controlled below the crossover frequency and acceleration level controlled above. The vibration frequency shall be varied approximately logarithmically between 20 Hz and 2 000 Hz. The entire frequency range of 20 Hz to 2 000 Hz and return to 20 Hz shall be traversed in not less than 4 mm. This cycle shall be performed 4 times in each of the orientations X, V. and Z (total of 12 times), so that the motion shall be applied for a total period of not less than 48 mm.
6 Examination and test measurements
After completion of the test, an external visual examination of the marking shall be performed without magnification or with a viewer having a magnification no greater than 3X and a visual examination of the case, leads, or seals shall be performed at a magnification between lOX and 20X. This examination and any additional specified measurements and examination shall be made after completion of the final cycle or upon completion of a group, sequence. or subgroup of tests which include this test.
When specified, devices with an internal cavity containing parts or elements subject to possible movement or breakage during vibration shall be further examined by radiographic examination or by delidding or opening and internal visual examination at 30X magnification to reveal damage or dislocation. Where this test is performed as part of a group or subgroup of tests, the post-test measurements or inspections need not be performed specifically at the conclusion of this test, but may be performed once at the conclusion of the group or subgroup.
Hermeticity tests for hermetic devices, visual examination, and electrical measurements that consist of parametric and functional testing shall be specified in the applicable procurement document.
7 FaIlure criteria
A device shall be considered a failure if hermetic limits are exceeded for hermetic devices, if parametric limits are exceeded or if functionality cannot be demonstrated under nominal and worst-case conditions specified in the applicable procurement document.
Mechanical damage such as cracking, chipping, or breaking of the package (lOx to 20x magnification) shall also be considered as failures, provided such damage was not incurred by fixing or handling
8 Summary
The following details shall be specified in the relevant specification:
a) electrical measurements, including any special acceptance criteria (see Clause 6);
b) sample size:
c) test conditions, if different from Clause 6:
d) hermeticity limits for hermetic devices (see Clause 6).IEC 60749-12 pdf download.